With the various types of high-end chip to enter the market application stage, the heat of the products also will be increased significantly beyond the limit of the current market traditional cooling fan, heat pipe and the water cycle program, resulting in high-end chip or product performance can not be fully realized, at the same time the life of a sharp decline due to a high temperature of the reasons. Chip cooling problem mainly for the unit area of ??heat exchange and cooling systems of space limitations, this global cooling problem has become a bottleneck inhibit the further development of the industry. 

 Refrigerant type chip cooling system (MRCC) can be solved completely the problem of high-end chip cooling. MRCC mainly uses direct micro-compressor refrigeration principle, R134A refrigerant cooling capacity to import into the microchannel evaporation of the cold head, and direct contact with the chip, to absorb the heat generated by the chip's operating temperature constant in the optimum working range. This product can also be called: contact cooling system, cooling system of the microchip, the chip micro-evaporative cooling system, compressor-type chip-cooling system. 

 Product Specifications 
 System current: 12V 5A 
 Cooling capacity: 50W-400W 
 Noise: 40DBA 
 Weight: 2.5KGS 
 Host size: 160x105x130mm 

 Product Features 
 ? Ultra-high cooling capacity and the effect of heat transfer, so that the computer performance, easier overclocking 
 ? Ultra-small size, can be placed in the computer chassis 
 ? Unique micro-channel evaporator design, the heat generated by absorption chip 
 ? World's smallest military miniature 12V DC inverter compressor 
 ? Reliable and stable system of refrigeration technology can be used in high temperature conditions 
 ? System intelligent control chip temperature automatically adjust the cooling capacity output, no condensation of water 
 ? Hose connection technology, user-friendly self-installed 
 ? Ultra-high energy efficiency, energy conservation, low-noise design 
 ? Design of the cold head of a standard module, a direct replacement for traditional cooling products 

 Applications: Suitable for high-contact cooling in the cooling capacity of 400W or less, single-chip multi-chip compatible. Mainly include: computer chip cooling, cooling of communications chips, servers, radar, server, and the LED cooling, the device-contact cooling.