Description: 

 With the various types of high-end chip to enter the market application stage, the heat of the products also will be increased significantly beyond the limit of the current market traditional cooling fan, heat pipe and the water cycle program, resulting in high-end chip or product performance can not be fully realized, at the same time the life of a sharp decline due to a high temperature of the reasons. Chip cooling problem mainly for the unit area of ??heat exchange and cooling systems of space limitations, this global cooling problem has become a bottleneck inhibit the further development of the industry. 

 Refrigerant type chip cooling system (MRCC) can be solved completely the problem of high-end chip cooling. MRCC mainly uses direct micro-compressor refrigeration principle, R134a refrigerant cooling capacity to import into the microchannel evaporation of the cold head, and direct contact with the chip, to absorb the heat generated by the chip's operating temperature constant in the optimum working range. This product can also be called: contact cooling system, cooling system of the microchip, the chip micro-evaporative cooling system, compressor-type chip-cooling system. 



 Product Specifications: 

 System current: 12V, 5A 

 Cooling capacity: 50W-400W 

 Noise: 45dB (A) 

 Weight: 2.5kg 

 Host size: 160x105x130mm 



 Product Features: 

 Ultra-high cooling capacity and heat transfer effects, computer performance, easier overclocking; 
 Ultra-small size, can be placed within the computer chassis; 
 The unique micro-channel evaporator design, absorb the heat generated by the chip; 
 Intelligent control of the system to automatically adjust the cooling capacity output chip temperature, no condensation of water; 
 The hose connection technology, user-friendly self-installation; 


 Application areas: 

 Applicable to high-contact cooling in the cooling capacity of 400W or less, single-chip multi-chip compatible. Mainly include: computer chip cooling, cooling of communications chips, servers, radar, server, and the LED cooling, the device-contact cooling.